Add Qualcomm SPEL cooling device support#583
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This commit adds complete support for Qualcomm SPEL-based thermal cooling on Qualcomm SOCs. SPEL stands for SoC Power Estimation and Limiting and is a power capping mechanism that allows limiting power consumption at the SOC and SYS domain levels. Signed-off-by: Priyansh Jain <priyansh.jain@oss.qualcomm.com>
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This commit adds complete support for Qualcomm SPEL-based thermal cooling on Qualcomm SOCs. SPEL stands for SoC Power Estimation and Limiting and is a power capping mechanism that allows limiting power consumption at the SOC and SYS domain levels.